Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for 1U Server and up, Support 205 Watts CPU Power Heat Dissipation.
Note:
Dynatron S2, S3, S4, S5, S6, and S7 each comes
with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are
available upon request.
|
CPU Support |
Intel® Sapphire Rapids Processor |
|
CPU Socket |
Socket FCLGA 4677 |
|
Solution |
Blade and 1U Server |
|
Dimensions |
118 x 78 x 27 mm |
|
Weight |
437.60 g |
|
Material |
Copper Vapor Chamber and Fin Stack |
|
Thermal Grease |
Pre-Printed with SHIN-ETSU 7762 |
